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<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.2d1 20170631//EN" "JATS-journalpublishing1.dtd">
<article xlink="http://www.w3.org/1999/xlink" dtd-version="1.0" article-type="general-sciences" lang="en"><front><journal-meta><journal-id journal-id-type="publisher">IJCRR</journal-id><journal-id journal-id-type="nlm-ta">I Journ Cur Res Re</journal-id><journal-title-group><journal-title>International Journal of Current Research and Review</journal-title><abbrev-journal-title abbrev-type="pubmed">I Journ Cur Res Re</abbrev-journal-title></journal-title-group><issn pub-type="ppub">2231-2196</issn><issn pub-type="opub">0975-5241</issn><publisher><publisher-name>Radiance Research Academy</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="publisher-id">2571</article-id><article-id pub-id-type="doi"/><article-id pub-id-type="doi-url">http://dx.doi.org/10.31782/IJCRR.2018.9193</article-id><article-categories><subj-group subj-group-type="heading"><subject>General Sciences</subject></subj-group></article-categories><title-group><article-title>Study of Structural and Morphological Properties of Vacuum Coated Copper Oxide (Cuo) Thin Film by Thermal Evaporation Technique&#13;
</article-title></title-group><contrib-group><contrib contrib-type="author"><name><surname>J.</surname><given-names>Suganthi</given-names></name></contrib><contrib contrib-type="author"><name><surname>Jain</surname><given-names>Priyanka</given-names></name></contrib><contrib contrib-type="author"><name><surname>S.</surname><given-names>Johnsonjeyakumar</given-names></name></contrib></contrib-group><pub-date pub-type="ppub"><day>14</day><month>11</month><year>2018</year></pub-date><volume>10</volume><issue>21</issue><fpage>91</fpage><lpage>93</lpage><permissions><copyright-statement>This article is copyright of Popeye Publishing, 2009</copyright-statement><copyright-year>2009</copyright-year><license license-type="open-access" href="http://creativecommons.org/licenses/by/4.0/"><license-p>This is an open-access article distributed under the terms of the Creative Commons Attribution (CC BY 4.0) Licence. You may share and adapt the material, but must give appropriate credit to the source, provide a link to the licence, and indicate if changes were made.</license-p></license></permissions><abstract><p>In this present study Copper and Copper oxide thin film deposited on a glass substrate by vacuum coater. Thermal evaporation deals with the evaporation of the source materials in a vacuum chamber and condensing the evaporated particles on a substrate. This process is conventionally called vacuum deposition. The structural, morphological studies of Copper (Cu) and copper oxide (CuO) thin films prepared by thermal evaporation method have been studied. Structural analysis results of Cu thin films demonstrate that the single phase of Cu with high a crystalline structure with a preferred orientation (111). X-ray diffraction results confirm the formation of pure (CuO) phase in thermal evaporation method. The SEM images of CuO thin films shows morphology of CuO thin films prepared at 100__ampersandsigndeg;C. The images show that the grains are not highly homogeneous in shape and size there is shape cubic, spherical and others.&#13;
</p></abstract><kwd-group><kwd>Copper Oxide</kwd><kwd> Morphology</kwd><kwd> Structural properties</kwd><kwd> Thin Films</kwd><kwd> Thermal Evaporation etc.</kwd></kwd-group></article-meta></front></article>
